COMPANY INFORMATION
ASONIKA, LLC (founded in 2018) is an engineering consulting firm that provides modeling and simulation of electronics used for harsh environments. We are recognized experts in the field of reliability, safety and diagnostic assessment at box (system), board, and component level design. Our mission is to provide significant time and cost savings to create new devices with increased reliability and quality by reducing actual number of iterative tests required to carry out.
REFERENCES
Beneficiaries of our services include small to large companies and institutions in North America, Europe and Asia such as Nvidia, AMD, NXP, NASA, JEDEC, iST, Texas Instruments, Bosch, Infineon, On Semiconductor, Ansys, etc.
CONSULTING SERVICES
We help clients in:
- Establishing internal reliability programs: testing strategies, accelerated test plans, design of experiment, test vehicles, design-for-test, design for reliability, life prediction techniques.
- Assessing the reliability of existing or new technologies for systems such as eVTOLs, autonomous vehicle technology, UAS/UAVs; board-level such as regular PCBs and advanced flex circuits; component-level such as BGA/FOWLP, vibration isolators, heatsinks; interconnect-level such as eutectic, lead-free and low temperature solders.
- Producing Safety Assessment Reports (SARs) with appropriate methodologies such as Failure Modes Effects Criticality Analysis (FMECAs), Reliability Block Diagrams (RBDs) and Fault Tree Analysis (FTAs).
- Analyzing Unit Under Test (UUT) endurance against external influence factors and obtain admissible values for acceleration, temperature and other characteristics through modeling and simulations:
- with the help of structural (thermal, mechanical) parameter identification methods to inexpensively obtain representative stresses and strains for hard to reach locations and measure small geometries (i.e. solder balls)
- to help determine its natural frequencies and whether such natural frequencies are absent in a given frequency range
- for static loads (gravity, pressure, temperature distribution); linear acceleration; acoustic noise; sinusoidal or random broadband vibration with elevated acceleration amplitude or power spectral density (in critical modes, including those that cannot be reproduced during field tests); elevated (low) operating or maximum temperature of the environment; thermal cycling; electromagnetic compatibility (EMC); reliability (failure-free operation and fatigue life), taking into account thermal and mechanical influences
- for strength and durability against the influence of a sinusoidal or random broadband vibration; single/multiple mechanical shocks
- with concurrent exposure to steady-state or cyclic temperature along with sinusoidal/random vibration or single/multiple mechanical shocks.
- document flow automation of an electronic model within the framework of Continuous Acquisition and Life-cycle Support (CALS-technologies)