Solutions Overview
ASONIKA, LLC can create an electronic (virtual) model for the design of radio-electronic means (REM) and then implement a framework that would populate results for that particular engineering problem. Modeling and simulation is done for electrical, thermal, mechanical and other physical and diagnostic processes, which can then be integrated with well-known topological design tools for printed circuit boards and widely used CAD systems. The following analyses can be performed at box (system), board, component and interconnect level.
Thermal analysis of load-bearing structures and blocks
Perform simulation of steady-state and transient thermal processes for arbitrary REM design using a thermal networks topology. This allows for a relatively short time to synthesize models of thermal processes based on models with typical elements. A database containing structural materials such as heatsinks can be created and maintained.
Mechanical durability analysis of load-bearing structures and blocks
Typical designs
Calculate mechanical characteristics for REMs with typical block geometries when subjected to sinusoidal and random vibrations, single and multiple shocks, linear accelerations. The CAD model can be created in accordance with the existing assembly drawings and simulation results can be displayed for the mechanical characteristics of the design. A database containing structural materials with physical and mechanical parameters can be created and maintained.
Cabinet and rack design
Calculate mechanical characteristics for REMs with cabinet and rack geometries when subjected to sinusoidal and random vibrations, single and multiple shocks, linear accelerations. The CAD model can be created in accordance with the existing assembly drawings and simulation results can be displayed for the mechanical characteristics of the design. A database containing structural materials with physical and mechanical parameters can be created and maintained.
Arbitrary volumetric designs
Calculate mechanical characteristics for REMs with arbitrary volumetric geometries when subjected to sinusoidal and random vibrations, single and multiple shocks, linear accelerations. The CAD model can be created with a CAD-system such as SolidWorks or FreeCAD, or it can be imported in IGES or SAT formats. A database containing structural materials with physical and mechanical parameters can be created and maintained.
System identification
Perform parameter identification for materials of REM model which include modulus of elasticity, Poisson’s ratio, initial mechanical loss coefficient (MLC) or the damping factor, and MLC dependent mechanical stress coefficient.
Design with vibration isolators
Calculate mechanical characteristics of cabinets, racks and REM units installed on vibration isolators when subjected to sinusoidal and random vibrations, single and multiple shocks, linear accelerations, acoustic noise. An assessment can be made on the obtained results in order to ensure the strength of the REM against the applied mechanical stress. The CAD model can be created in accordance with the existing assembly drawings and simulation results can be displayed for the mechanical characteristics of the design. A database containing structural materials with physical and mechanical parameters for vibration isolators can be created and maintained.
Thermal and mechanical analysis of printed circuit board assemblies
Perform modeling and simulation for thermal and mechanical characteristics of printed circuit board assemblies (PCBAs) and radio-frequency (RF) components when subjected to sinusoidal and random vibrations, single and multiple shocks, linear accelerations, acoustic noise. The CAD model can be created in accordance with the existing assembly drawings or imported from P-CAD, Mentor Graphics, Altium Designer, OrCAD and simulation results can be displayed for thermal and mechanical characteristics of the design. A database containing geometrics, thermal and mechanical parameters for RF components as well as required structural materials with thermal and mechanical parameters can be created and maintained.
Reliability analysis
Perform reliability analyses for cabinets, blocks, printed circuit board assemblies, RF components and provide the following results: determine failure rates for all RF components; assess the need for redundant components for fault-tolerant REM design. The following redundancy types can be calculated: full on redundancy (single unit necessary for survival); full on redundancy (multiple units necessary for survival); standby redundancy with ideal switch (single unity necessary for survival); standby redundancy with ideal switch (multiple units necessary for survival); standby redundancy with non-ideal switch (single unit necessary for survival). The following results can be calculated: operational failure rates, probabilities of failure-free operation and mean time of failure free operation for the REM design. A database containing mathematical models for calculating operational failure rates for RF components along with model coefficients can be created and maintained.
Fatigue durability analysis
Calculate time to fatigue failure for printed circuit boards and RF components subjected to sinusoidal and random vibrations, and multiple shocks. The modeling and simulation results will contain modal shapes and natural frequencies for printed circuit board assemblies, as well as displacements, stresses and accelerations at the nodes of the design. A database containing fatigue parameters for design materials can be created and maintained.
Electromagnetic compatibility analysis
Perform the following tasks: calculate the strength of the electric and magnetic fields in 3 dimensions inside a standard and arbitrary housing of the REM unit (model files can be imported in IGES and SAT formats) when subjected to electromagnetic waves; calculate shielding efficiency against electric and magnetic fields from a standard and arbitrary housing of the REM unit. A database containing electromagnetic parameters for design materials can be created and maintained.
Diagnostics engineering
FMECA+
Create failure modes effect criticality analysis (FMECA) to highlight single point failures requiring corrective action; aid in developing test methods and troubleshooting techniques; provide foundation for qualitative diagnostic, reliability, maintainability, safety and logistics analyses; provide estimates of system critical failure rates; provide a quantitative ranking of a system and/or subsystem failure modes relative to mission importance; identify parts and systems most likely to fail; maintain as a continuous improvement tool for making program decisions regarding trade-offs affecting design integrity.
Diagnostics assessment
Implement efficient test strategy through Object Oriented Modeling (OOM) topology. Create diagnostic analysis, develop testability metrics, and generate reports to facilitate design and diagnostic optimization through diagnostic conclusion.
Analysis of RF components and materials
Create and maintain a reference database of RF components and materials to provide information for material parameters and parameters for RF components. The reference database for RF components with consist of main and ancillary tables. The main tables can contain: parameters for materials of printed circuit board assemblies, load-carrying structures, RF component leads and varnishes (adhesives) used when RF components are installed on a printed circuit board – mechanical, thermal, permissible temperature dependent functions; optical properties of materials for REM design; RF component parameters: RF component classes and groups; RF component types and technical specifications; RF component designation; parameters included with the designation and their possible values; installation options of RF components on a printed circuit board; models for RF component installation options; geometric, mechanical, thermal, electrical, fatigue, reliability, admissible parameters for RF components; RF component images on the plane and in space. Ancillary tables can contain numeric, string, logical, text, graphic and functional dependencies for RF component parameters.
Data management for design modeling
Provide and maintain end-to-end CAD system integration – Pro/Engineer, P-CAD, AutoCAD, PSpice, etc., and to manage the transfer of data between various modeling stages during the REM design engineering process. Deliver an integrated REM electronic model within the framework of mathematical modeling for thermal, electrical, aerodynamic, electromagnetic, mechanical processes as well as a mathematical model for the REM reliability quality.