SYSTEM AND BOX LEVEL ANALYSES OF ELECTRONIC EQUIPMENT SUBJECTED TO THERMAL INFLUENCES
Provide analysis for the following design types: micro-assemblies, radiators and heatsinks, hybrid integrated circuits, stackable and cassette type design blocks, cabinets, racks, as well as arbitrary designs of radio-electronic means (REMs).
Provide analysis for stationary as well as transient thermal profiles of the electronic equipment operating under natural and forced convection in the ambient environment, both under normal and reduced pressure
Thermal networks model of the REM design block, constructed within the graphical user interface
high-rise cabinet
cassette-type unit
During the analysis of arbitrary design, the temperatures of the selected isothermal volumes are calculated and the plots for the temperature versus time for a transient thermal profile is derived
