BOARD LEVEL ANALYSES OF RADIO-ELECTRONIC MEANS SUBJECTED TO THERMAL AND MECHANICAL INFLUENCES

Provide analyses for printed circuit assemblies of radio-electronic means, by generating calculation results on:
1) stationary and transient thermal profiles under normal as well as reduced pressure;
2) mechanical influences such as: a) harmonic vibration; b) random vibration; c) single and multiple impacts; d) linear acceleration; e) acoustic noise.


Acceleration versus frequency and time at control points of the design


Maximal temperature, acceleration, and stress regions of printed circuit assemblies and electronic components

The following converters with well-known PCB CAD tools can be supported: PCAD, Mentor Graphics, Altium Designer, OrCAD. The location coordinates of all electronic components on the board can be automatically imported.

Thermal and mechanical mode forms for electronic components

An ongoing database can be supported with references containing geometrical, physics-based thermal and mechanical parameters on electronic components and design materials