BOARD AND COMPONENT LEVEL FATIGUE ANALYSES OF RADIO-FREQUENCY COMPONENTS SUBJECTED TO THERMAL AND MECHANICAL INFLUENCES

Calculate time to fatigue failure for printed circuit boards and radio-frequency components subjected to harmonic vibration, random vibration, single and multiple shocks. The simulation results will contain particular frequency modes for printed circuit assemblies as well as displacement, stress, and acceleration values in the design assembly. All RF components and material properties can be automatically imported from the supportable database tool. All printed circuit assembly parameters can be converted from other supportable design tools. An example of a convenient user-friendly input-output interface is presented below.